Effect of Cu-nanoparticles on Anticorrosion Performance of Polymeric Films

Document Type : Original Article

Authors

1 Master of Polymer Processing Engineering, Beasat Company, Qom, Iran

2 Ph.D. in Chemical Engineering, Beasat Company, Qom, Iran

3 MSc in Chemical Engineering Biotechnology, Beasat Company, Qom, Iran

Abstract

The present paper seeks to study the active polymeric film with corrosion protection capability. Due to the reactivity of their active component with corrosive gaseous agents, these materials are called active polymers. The structure of these compounds consists of a polymeric substrate (such as polyethylene, polypropylene or polystyrene) containing copper nanoparticles (Cu- nanoparticles) that, by reacting and neutralizing corrosive gases, prevent the penetration of undesirable agents into the packaging. Cu-nanocomposites do not contaminate the protected parts. The most important feature of these films is the ability to remove and neutralize the corrosive gases in the packaging atmosphere.  Also, these compounds simultaneously, using a single film, have the ability to protect against corrosion, moisture and the dangers of static electricity accumulation over a relatively long period (more than 7 years). Despite the possibility of using conventional manufacturing methods, today efforts are being made to develop production methods for easier application of these films in various industries. In this work, basic concepts, applications, production techniques, anticorrosion and electrical properties, as well as the governing mechanism on the performance of films containing copper nanoparticles are described.

Keywords

References

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History

  • Receive Date: 21 April 2018
  • Revise Date: 23 August 2018
  • Accept Date: 21 September 2018
  • Publish Date: 23 August 2018

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