بررسی اثر سقوط و ضربه، بر بسته بندی دستگاه های الکترونیکی در هنگام حمل و نقل

نویسندگان

1 کارشناسی ارشد مهندسی برق، دانشکده مهندسی، دانشگاه سلمان فارسی کازرون

2 دانشجوی کارشناسی مهندسی برق- الکترونیک، بخش مهندسی برق، دانشکده مهندسی، دانشگاه سلمان فارسی کازرون

چکیده

دستگاه ­های الکترونیکی قابل حمل همواره در معرض ضربات ناشی از سقوط قرار دارند. به همین دلیل، بسته­ بندی محصول و در نتیجه میزان مقاومت در مقابل ضربه یکی از مهم ­ترین نگرانی ­ها در طراحی قطعات و دستگاه ­های الکترونیکی قابل حمل و همچنین بسته­ بندی آن­ها می­ باشد. بنابراین سازندگان قطعات، آزمون های آزمایشگاهی و مدل ­های شبیه ­سازی مختلفی را جهت انتخاب بهترین روش مونتاژ و بسته ­بندی قطعات و دستگاه­ های الکترونیکی قابل حمل و همچنین بررسی اثرات سقوط و ضربه بر روی آن­ها انجام می ­دهند. به علت اندازه­ های کوچک این نوع از محصولات الکترونیکی، انجام آزمون­های آزمایشگاهی سقوط، جهت بررسی فرآیندهای شکست و رفتار این نوع محصولات در مقابل ضربات به تنهایی مشکل و زمان­بر بوده و هزینه ­های زیادی را تحمیل می­ کنند. بنابراین محققان از هر دو روش آزمون­ های تجربی و مدل ­های شبیه ­سازی برای بررسی اثرات ضربه و سقوط بر روی آن­ها استفاده می­ کنند. تحقیق حاضر، مروری بر روش ­های آزمایش تجربی، مدل­ های شبیه ­سازی و تأثیرات آن­ها بر بسته ­بندی و طراحی و جانمایی قطعات الکترونیکی است. همچنین استانداردهای موجود در این زمینه و روش ­های استاندارد برای آزمون سقوط معرفی شده و مختصراً شرح داده شده ­اند.

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