بررسی اثر سقوط و ضربه، بر بسته بندی دستگاه های الکترونیکی در هنگام حمل و نقل

نویسندگان

1 کارشناسی ارشد مهندسی برق، دانشکده مهندسی، دانشگاه سلمان فارسی کازرون

2 دانشجوی کارشناسی مهندسی برق- الکترونیک، بخش مهندسی برق، دانشکده مهندسی، دانشگاه سلمان فارسی کازرون

چکیده

دستگاه ­های الکترونیکی قابل حمل همواره در معرض ضربات ناشی از سقوط قرار دارند. به همین دلیل، بسته­ بندی محصول و در نتیجه میزان مقاومت در مقابل ضربه یکی از مهم ­ترین نگرانی ­ها در طراحی قطعات و دستگاه ­های الکترونیکی قابل حمل و همچنین بسته­ بندی آن­ها می­ باشد. بنابراین سازندگان قطعات، آزمون های آزمایشگاهی و مدل ­های شبیه ­سازی مختلفی را جهت انتخاب بهترین روش مونتاژ و بسته ­بندی قطعات و دستگاه­ های الکترونیکی قابل حمل و همچنین بررسی اثرات سقوط و ضربه بر روی آن­ها انجام می ­دهند. به علت اندازه­ های کوچک این نوع از محصولات الکترونیکی، انجام آزمون­های آزمایشگاهی سقوط، جهت بررسی فرآیندهای شکست و رفتار این نوع محصولات در مقابل ضربات به تنهایی مشکل و زمان­بر بوده و هزینه ­های زیادی را تحمیل می­ کنند. بنابراین محققان از هر دو روش آزمون­ های تجربی و مدل ­های شبیه ­سازی برای بررسی اثرات ضربه و سقوط بر روی آن­ها استفاده می­ کنند. تحقیق حاضر، مروری بر روش ­های آزمایش تجربی، مدل­ های شبیه ­سازی و تأثیرات آن­ها بر بسته ­بندی و طراحی و جانمایی قطعات الکترونیکی است. همچنین استانداردهای موجود در این زمینه و روش ­های استاندارد برای آزمون سقوط معرفی شده و مختصراً شرح داده شده ­اند.

کلیدواژه‌ها

عنوان مقاله [English]

Investigating the effect of falls and impacts on the packaging of electronic devices during transportation

مراجع

  1. Low, K.H., (2003). "Drop-impact cushioning effect of electronics products formed by plates". Advances in engineering software, Vol. 34, pp. 31–50.
  2. Luan, J., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z., (2007). "Dynamic responses and solder joint reliability under board level drop test". Microelectronics Reliability Vol. 47, pp. 450–460.
  3. Zhang, B., Ding, H., Sheng, X., (2008). "Modal analysis of board-level electronic package". Microelectronic engineering, Vol. 85, pp. 610–620.
  4. Zhou, C.Y., Yu, T.X., (2009). "Analytical models for shock isolation of typical components in portable electronics". International journal of impact engineering, Vol. 36, pp. 1377–1384.
  5. Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., Zhong, Z., (2003). "Board level drop test and simulation of TFBGA packages for telecommunication applications". Electronic components and technology conference, Proceedings. 53rd, pp. 121 – 129.
  6. Zhu, L., Marcinkiewicz, W., (2005). "Drop impact reliability analysis of csp packages at board and product system levels through modeling approaches". IEEE Transactions on components and packaging technologies, Vol. 28, No. 3, pp. 449–456.
  7. Wong, E. H., Seah, S. K. W., van Driel, W. D., Caers, J. F. J. M., Owens, N., Lai, Y. S., (2009). "Advances in the drop-impact reliability of solder joints for mobile applications". Microelectronics reliability, Vol. 49, No. 2, pp. 139–149.
  8. Low, K.H., Yang, A., Hoon, K.H., Zhang, X., Lim, J.K.T., Lim, K.L., (2001). "Initial study on the drop-impact behavior of mini Hi-Fi audio products". Advances in engineering software, Vol. 32, No. 9, pp. 683–693.
  9. Low, K.H., Wang, Y., Hoon, K.H., Wai, W.K., (2004). "A virtual boundary model for a quick drop–impact analysis of electronic components in TV model". Advances in engineering software, Vol. 35, pp. 537–551.
  10. Wang, Y.Y., Lin, T.Y., Hua, L., (2003). "Drop-impact simulation and experimental verification for spindle fixation of video and audio module". Mechatronics, Vol. 13, No. 5, pp. 427–440.
  11. Wang, Y.Y., Lu, C., Li, J., Tan, X.M., Tse, Y.C., (2005). "Simulation of drop/impact reliability for electronic devices", Finite elements in analysis and design, Vol. 41, No. 6 ,pp. 667–680.
  12. Sharan, K., Lahoti, S., Zhou, J., (2006). "Dynamic response of a portable electronic product subjected to an impact load". Thermal and thermomechanical proceedings 10th Intersociety conference on phenomena in electronics systems, San Diego, pp. 1049 – 1055.
  13. Lim, C.T., Teo, Y. M., Shim, V. P. W., (2002). "Numerical simulation of the drop impact response of a portable electronic product". IEEE Transactions on components and packaging technologies, Vol. 25, No. 3.
  14. Wang, Y., Low, K. H., Pang, H. L. J., Hoon, K. H., Che, F. X., Yong, Y. S., (2006). "Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards". Microelectronics reliability, Vol. 46, No. (2-4), pp. 558–573.
  15. Mattila, T. T., Vajavaara, L., Hokka, J., (2013). "An approach to board-level drop reliability evaluation with improved correlation with use conditions". IEEE 63rd Electronic components & technology conference, Las Vegas, NV, pp. 1259 – 1268.
  16. JEDEC, (2003). "Board level drop test method of components for handheld electronic products". JEDEC Document for board level drop test method of components for handheld electronic products, JEDEC Solid State Technology Association, Arlington, VA, Paper No. JESD22-B111.
  17. Lall, P., Panchagade, D.R., Choudhary, P., Gupte, G., Suhling, J.C., (2008). "Failure-Envelope approach to modeling shock and vibration survivability of electronic and mems packaging". IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1.
  18. Yu, D., Kwak, J.B., Park, S., Lee, J., (2010). "Dynamic responses of PCB under product-level free drop impact". Microelectronics reliability, Vol. 50, No. 7, pp. 1028–1038.
  19. Luan, J. E., Tee, T. Y., (2004). "Analytical and numerical analysis of impact pulse parameters on consistency of drop impact results". Sixth Electronics packaging technology conference, pp. 664 - 670.
  20. Yeh, C.L., Lai, Y.S., Kao, C.L., (2006). "Evaluation of board-level reliability of electronic packages under consecutive drops". Microelectronics reliability, Vol. 46, pp. 1172–1182.
  21. Yau, Y.H., Hua, S.N., (2011). "A comprehensive review of drop impact modeling on portable electronic devices". Applied mechanics reviews, Vol. 64, pp. 020803-17.
  22. JEDEC Document for Board Level Drop Test Method of Components for Handheld Electronic Products, "Subassembly Mechanical Shock", JEDEC Solid state technology association, Arlington, VA, Paper No. JESD22-B110A.
  23. Goyal, S., Buratynski, E.K., (2000). "Methods for realistic drop-testing". International journal of microcircuits and electronics packaging, Vol.23, No.1, pp.45–52.
  24. Shim, V.P.W., Lim, C.T., (2000). "Impact drop tester for portable consumer products". US patent, No. 09/592,262.
  25. Seah, S.K.W., Lim, C.T., Wong, E.H., Tan, V.B.C., Shim, V.P.W., (2002). "Mechanical response of PCBs in portable electronic products during drop impact". the 4th Electronics packaging technology conference, Singapore, pp. 120–125.
  26. Lim, C.T., Low, Y.J., (2002). "Investigating the drop impact of portable electronic products". The 52nd Electronic components & technology conference, United States, pp. 1270–1274.
  27. Lim, C.T., Ang, C.W., Tan, L.B., Seah, S.K.W., Wong, E.H., (2003). "Drop impact survey of portable electronic products". The 53rd Electronic components and technology conference, Proceedings, pp. 113–120.
  28. Zhou, C.Y., Yu, T.X., Lee, R. S.W., (2008). "Drop/impact tests and analysis of typical portable electronic devices". International journal of mechanical sciences, Vol. 50, No. 5, pp. 905–917.
  29. Tan, L.B., Ang, C.W., Lim, C.T., Tan, V.B.C., Zhang, X., (2005). "Modal and impact analysis of modern portable electronic products". The proceedings of the 55th electronic component and technology conference, Lake Buena Vista, Vol. 1, pp. 645–653.
  30. Nagaraj, B., (1997). "Drop impact simulation of a custom pager product". Advanced electronic packaging, Vol. 1, pp. 539–547.
  31. Lu, C., Li, J., Tse, Y.C., Wang, Y.Y., (2001). "Drop-test simulations for electronic devices with packaging materials", Joint NCHC-IHPC Seminar, Taiwan, 9.
  32. Cadge, D., Wang J.H.J., Bai, R., Gong, P., (2006). "Drop test simulation of electronic devices using finite element method". Electronic materials and packaging, EMAP 2006, International conference on, pp. 1-7.
  33. Goyal, S., Upasani, S., Patel, D. M., (1999). "Improving impact tolerance of portable electronic products: Case study of cellular phones," Experimental mechanics, Vol. 39, No. 1, pp. 43–52.
  34. Liu, S., Wang, X., Ma, B., Gan, Z., Zhang, H., (2005). "Drop test and simulation of portable electronic devices". sixth International conference on electronic packaging technology, Shenzhen, China, pp. 1-4.
  35. Mattila, T.T., Vajavaara, L., Hokka, J., Hussa, E., Mäkelä, M., Halkola, V., (2014). "Evaluation of the drop response of handheld electronic products". Microelectronics reliability, Vol. 54, No. 3, pp. 601–609.

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سابقه مقاله

  • تاریخ دریافت: 18 مرداد 1396
  • تاریخ بازنگری: 06 آبان 1403
  • تاریخ پذیرش: 28 شهریور 1397
  • تاریخ انتشار: 01 شهریور 1396

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